Physical property table of PP material
2025-03-10 09:00:31
Physical property of PP material
I. Physical Properties
Item | Value | Remarks |
---|---|---|
Density | 0.90 - 0.91 g/cm3 | Slightly different due to different polymerization methods and additives |
Melting Point | 160 - 170 ℃ | The melting point of homopolymer PP is relatively high, and that of copolymer PP is slightly lower |
Heat Deflection Temperature (1.82MPa) | 60 - 120 ℃ | Adding reinforcing materials can significantly increase it |
Vicat Softening Point | 140 - 150 ℃ | - |
Coefficient of Linear Expansion | (6 - 10)×10?? K?1 | Increases with the rise of temperature |
Water Absorption Rate | <0.03 % | The water absorption rate is extremely low at room temperature |
II. Mechanical Properties
Item | Value | Remarks |
---|---|---|
Tensile Strength | 25 - 40 MPa | The strength of homopolymer PP is relatively high, and the strength of copolymer PP is relatively low |
Elongation at Break | 200 - 800 % | The elongation at break of copolymer PP is relatively high |
Flexural Strength | 30 - 50 MPa | - |
Flexural Modulus | 800 - 1500 MPa | Adding filler materials can increase the flexural modulus |
Impact Strength (Notched) | 2 - 10 kJ/m2 | The impact strength decreases significantly at low temperatures |
Rockwell Hardness | R95 - 105 | - |
III. Thermal Properties
Item | Value | Remarks |
---|---|---|
Thermal Conductivity | 0.12 - 0.24 W/(m·K) | The thermal conductivity is low, and it is a good thermal insulation material |
Specific Heat Capacity | 1.9 - 2.3 J/(g·K) | Slightly changes with the change of temperature |
Decomposition Temperature | >270 ℃ | Stable under normal processing and use temperatures |
IV. Electrical Properties
Item | Value | Remarks |
---|---|---|
Dielectric Constant (1MHz) | 2.2 - 2.6 | The frequency has little effect on the dielectric constant |
Dissipation Factor (1MHz) | <0.001 | It has excellent electrical insulation performance |
Volume Resistivity | >1013 Ω·cm | - |
Dielectric Breakdown Voltage Strength | 30 - 35 kV/mm | Depends on the material thickness and processing technology |